Wafer-level integration of self-aligned high aspect ratio silicon 3D structures using the MACE method with Au, Pd, Pt, Cu, and Ir

• Mathias Franz,
• Romy Junghans,
• Paul Schmitt,
• Adriana Szeghalmi and
• Stefan E. Schulz

Beilstein J. Nanotechnol. 2020, 11, 1439–1449, doi:10.3762/bjnano.11.128

• fabrication uses cost-efficient subprocesses and omits expensive processes such as nanopatterning with high-resolution lithography. One low-cost method for the fabrication of such high aspect ratio templates and structures is metal-assisted chemical etching (MACE). This process uses a noble metal catalyst

Charged particle single nanometre manufacturing

• Philip D. Prewett,
• Cornelis W. Hagen,
• Claudia Lenk,
• Steve Lenk,
• Marcus Kaestner,
• Tzvetan Ivanov,
• Ahmad Ahmad,
• Ivo W. Rangelow,
• Xiaoqing Shi,
• Stuart A. Boden,
• Alex P. G. Robinson,
• Dongxu Yang,
• Sangeetha Hari,
• Marijke Scotuzzi and
• Ejaz Huq

Beilstein J. Nanotechnol. 2018, 9, 2855–2882, doi:10.3762/bjnano.9.266

• , demonstrating control over the feature size by etching a series of holes with diameters of 17–200 nm in a Si3N4 membrane using XeF2. From the point of view of high-resolution lithography, an interesting result was reported by Ganczarczyk [93] who etched 30 nm lines into a GaAs substrate in an SEM, using XeF2 as

• emission electron scanning probe lithography (FE-eSPL) as the chosen charged particle beam-based SPL method, which offers high-resolution lithography and high writing speeds [125][126]. In FE-eSPL, electrons emitted from the tip of a scanning probe are used to expose the resist. In this respect, the FE

Assembly of metallic nanoparticle arrays on glass via nanoimprinting and thin-film dewetting

• Sun-Kyu Lee,
• Sori Hwang,
• Yoon-Kee Kim and
• Yong-Jun Oh

Beilstein J. Nanotechnol. 2017, 8, 1049–1055, doi:10.3762/bjnano.8.106

• , high-resolution lithography techniques – such as electron beam lithography (EBL) or laser interference lithography (LIL) – with a conventional multistep etching process on a silicon wafer are still required to fabricate templates with nanostructured surface topographies that determine the features of

Fabrication of high-resolution nanostructures of complex geometry by the single-spot nanolithography method

• Alexander Samardak,
• Margarita Anisimova,
• Aleksei Samardak and
• Alexey Ognev

Beilstein J. Nanotechnol. 2015, 6, 976–986, doi:10.3762/bjnano.6.101

• lithography; exposure dose; high-resolution lithography; nanomagnets; nanostructure; overexposure; PMMA; polymer; resist carbonization; Introduction The continuous growth of the nanotechnology and microelectronic industries requires the development of new approaches and methods for the formation of nanoscale